Xiaomi Improving Screen Form Of Its Smartphones

Today, a Weibo blogger said that this year’s Xiaomi’s new phones have a rich post-camera program. Xiaomi will gradually start to improve the screen form next year. Currently, we know that there several types of screens in mass production – single-punch straight screen solution in the middle, single-hole four-sided curved screen solution in the upper left corner, inner folding screen (folding model) solution, under-screen proactive (true full screen) solution, etc.

Xiaomi Mi Note 10 Lite

Earlier, the same blogger also said that the Mi 11 will use a hole-punch screen design with the hole in the upper left corner. This phone’s high-end version will use 2K + resolution and 120Hz refresh rate curved screen, while the standard version parameters are unknown. But at least, the screen is not straight.

What else?

In addition, although we do not know which model of the under-screen camera is, Xiaomi will be able to mass-produce the third-generation under-screen camera phone screen next year. Moreover, Huaxing Optoelectronics will supply it. Therefore, it is certain now that Xiaomi will launch and adopt it sometime next year. The new series of under-screen camera technology may even be directly applied to the flagship model from MIX series.

There is not much information about the Xiaomi folding screen models. But we know that the new folding screen model is codenamed Cetus. It will come with a 108MP camera and a Qualcomm Snapdragon processor. In addition, it will use an internal folding main screen similar to the Samsung Galaxy Fold + external sub. Currently, we don’t know about the screen design structure. The screen refresh rate is 90Hz (engineering machine), but it can be 120Hz. And it uses Samsung’s latest UTG flexible glass technology.

We learned that Qualcomm will hold the Snapdragon Technology Summit on December 1. Furthermore, we expect them to launch a new generation of flagship processor Snapdragon 875 at that time. In the next year, Xiaomi will launch models with the new Snapdragon 875 chip.

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