This afternoon, MediaTek officially released the Dimensity 1200 chip. It uses TSMC’s 6nm process, 1 Cortex-A78 large core 3.0GHz, 3 Cortex-A78 2.6GHz, 4 Cortex-A55 2.0GHz Core. Its performance is increased by 22%, energy efficiency is increased by 25%. The GPU scale has not changed much, and the performance is improved by up to 13%.
The Dimensity 1200 supports 5G connections in all scenarios. It supports 5G high-speed rail mode, 5G speed + 40%. The downlink speed reaches 400 Mbps +; supports 5G elevator mode, intelligently perceives 5G elevator scenes. The average fast competition product is 3 seconds. Using 5G UltraSave smart SA measurement scheduling, smart SA/NSA hybrid network search strategy, SA performance is more power-efficient. The following are the main features of MediaTek Dimensity 1200:
Dimensity 1200 Strong Performance
The Dimensity 1200 is based on TSMC’s 6-nanometer advanced manufacturing process. The CPU adopts a 1+3+4 flagship three-plex architecture design. It includes an Arm Cortex-A78 super core with a clock speed of up to 3.0GHz, with a nine-core GPU and six-core MediaTek APU 3.0, and dual-channel UFS 3.1. The platform performance has been greatly improved.
Dimensity 1200 5G Connectivity
The Dimensity 1200 maintains a continuous leadership in 5G. It supports independent (SA) and non-independent (NSA) networking modes, 5G dual carrier aggregation (2CC CA), dynamic spectrum sharing (DSS). It also supports MediaTek 5G UltraSave power saving technology. This chip has dual-card 5G standby and dual-card VoNR voice services under the 5G SA/NSA dual-module network.
The Dimensity 1200 takes the lead in supporting the sub-6GHz full frequency band and large bandwidth of global 5G operators. It is also committed to creating a panoramic and full-time seamless 5G connection experience for users, launching 5G high-speed rail mode, 5G elevator mode and other application modes. Through intelligent scene sensing, fast signal capture and tracking, intelligent network search and network stationing, the terminal has an efficient and stable 5G performance. It is combined with MediaTek 5G UltraSave power saving technology, to bring lower power consumption 5G communication.
Flagship AI Multimedia
The Dimensity 1200 has MediaTek independent AI processor APU 3.0. It can give full play to the advantages of mixed precision, flexibly use integer precision and floating-point precision arithmetic. It achieve higher AI application energy efficiency. Combined with the AI multi-task scheduling mechanism, through the high integration of AI technologies such as AI noise reduction, AI exposure, and AI object tracking, it brings users new camera experiences such as “rapid night shooting” and “super panoramic night shooting”. Through AI multi-person real-time segmentation technology, smartphone video shooting special effects such as multi-person background replacement and multi-passenger removal can also be realized. It brings more excitement to the creation of 4K resolution video.
The Dimensity 1200 supports the leading chip-level single-frame progressive 4K HDR video technology. When users record 4K video, each frame is subjected to 3 exposure fusion processing, so that the video quality has excellent dynamic range. The color, contrast, details and other aspects have been significantly improved. So, combined with the HDR10+ video encoding technology of Dimensity 1200, the Staggered HDR video effect is completely output. It brings users a more stunning end-to-end cross-screen HDR experience. In addition, the Dimensity 1200 also supports AI video technology such as AI multi-person blurring, multi-depth intelligent focus, AI streaming media image quality enhancement, etc. It brings more innovative possibilities for vlog creation and live broadcast.
This chip uses AI technology to enhance video quality. It also uses artificial intelligence for deep learning of a large number of movies. It adjusts the video frame frame by frame from the director’s perspective, bringing SDR film sources a dynamic range close to HDR. SDR supported by AI Converting to HDR technology allows mobile terminals to present more exciting video images. In addition, the Dimensity 1200 supports up to 200 megapixel camera and AV1 video format.
The Dimensity 1200 also has the newly upgraded MediaTek HyperEngine 3.0 game optimization engine. It brings leading innovative technologies in the four core features of network optimization engine, control optimization engine, intelligent load control engine, and image quality optimization engine. HyperEngine 3.0 has once again upgraded the gaming network experience. Under the 5G network connection, dual card calls can be implemented in parallel. Users can receive calls from the secondary card while the primary card is playing mobile games. The game continues to be online. Super hotspot and high-speed rail game modes are optimized for different game environments, effectively reducing game network latency and lag.
The Dimensity 1200 is also the first to support the upcoming Bluetooth LE Audio (Bluetooth Low Energy Audio) standard. Compared with the traditional TWS true wireless Bluetooth headset, it can be expanded to two-channel streaming audio. The terminal and the TWS headset can obtain lower latency and extend the battery life of the headset. When the player is playing, the control engine of HyperEngine 3.0 allows the multi-finger touch time report rate to maintain a stable high frame operation. In addition, the intelligent load control engine of HyperEngine 3.0 adds high-brush power saving for games, smart healthy charging, and Wi-Fi 6 power saving modes. They are designed to balance performance and power consumption, and extend battery life and battery life.
In addition, MediaTek HyperEngine’s key technology for layout graphics-Ray Tracing, brings end game rendering to mobile terminals. It provides game manufacturers, developers, and terminals with powerful graphics processing capabilities. So it brings comparable performance to mobile game player’s real game graphics, leading the trend of mobile graphics technology.Many OEM manufacturers have expressed support for the new MediaTek Dimensity products, including Xiaomi, Vivo, OPPO, Realme, etc. The terminal will be launched in 2021.